Ufs Bga 254 Datasheet [exclusive] Jun 2026

| Ball Group | Pin Count | Description | |------------|-----------|-------------| | VCC (Main Supply) | ~20-30 balls (distributed) | 2.5V or 3.3V – core and NAND supply. Requires low-ESR decoupling caps. | | VCCQ (Controller I/O) | ~12-18 balls | 1.2V or 1.8V – interface logic and reference. | | VCCQ2 (Optional) | ~6-10 balls | 1.8V – for high-speed M-PHY. | | VSS (Ground) | ~60-80 balls | Multiple ground balls to reduce loop inductance. Critical for signal integrity. | | REF_CLK | 2 balls | Differential reference clock input (26MHz or 19.2MHz typical). | | UFS_D0_P / UFS_D0_N | 2 balls | Lane 0 differential pair (TX and RX shared). | | UFS_D1_P / UFS_D1_N | 2 balls | Lane 1 differential pair (optional for dual-lane mode). | | RST_N | 1 ball | Active-low hardware reset. Must be pulled high externally. | | CMD (Boot LUN) | 1 ball | Boot-specific control (varies by vendor). | | NC / RFU | ~40-60 balls | No Connect or Reserved for Future Use. Do not route to these. |

The most requested section of any is the ball map. Unlike a simple memory chip, UFS integrates a controller, so pin functions include power, ground, high-speed differential pairs, and control signals. Ufs Bga 254 Datasheet

If a website offers a "UFS BGA 254 Datasheet" without requiring a valid NDA or registration, it is likely incomplete or counterfeit. | Ball Group | Pin Count | Description

The is a standardized high-performance Ball Grid Array (BGA) package widely used in modern flagship and mid-range smartphones to house Universal Flash Storage (UFS) controllers and memory. Named for its 254-ball grid configuration, this package facilitates high-speed, full-duplex data transfers using the MIPI M-PHY physical layer. Technical Architecture and Standards | | VCCQ2 (Optional) | ~6-10 balls | 1